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FSM128 Film Stress & Wafer Bow

Brand:Frontier Semiconductor

Place of Origin:U.S.A


Keyword tag:FSM128;Film Stress ; Wafer Bow;Measurement System
021-37018108Online Message

       FSM pioneered and commercialized the laser scanning optical lever (Optilever) technique for film stress and wafer bow measurements. Frequently the tool is used for resolving issues such as film cracks, delamination, hillock and void formations. The new FSM 128 series , with its precision optics and scanner, is designed for R&D and production of next generation devices in the semiconductor, III-V, solar, MEMS, and data storage, and FPD industries.


Designed for:

·  Versatility
The FSM 128 NT can accommodate 50mm to 200 mm wafers without the need to change sample holder. Versions are also available for specialized applications. (For example, the FSM 128L accommodates up to 300mm wafers, while the FSM 128G is designed for panels up to 650 x 550mm)
·  Simple Sample Placement + Retrieval
With a retractable stage door mechanism, the wafer stage is conveniently accessed for easy wafer placement and retrieval, making multiple wafer measurements a breeze.
·  Auto Switching Dual Laser
The FSM 128 series features a patented auto laser technology. When a sample’s reflectivity is poor, the system will switch to an alternate laser with different wavelength. This enables the end user to measure almost any type of film including nitrides, polyimides, low k, high k, or metals, without problems.
·  2-D & 3-D Mapping
With a motorized rotation stage, the FSM 128 can very quickly generate a 3-D map to help the end user to visualize whole wafer curvature or stress changes to pinpoint localized regions where there are process and uniformity issues.
·  Film Thickness
Film thickness mapping for dielectric films can be integrated into the FSM 128, transforming the tool into a powerful and versatile desktop unit for R&D and production environments.

Result graphs or maps are easily exported to Excel™ or Word Documents to generate reports



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